Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-07-23
1999-11-09
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
059802693
ABSTRACT:
A printed circuit assembly comprises a first printed circuit (5) having conductive (4) paths formed on a top surface (27) thereof and a second printed circuit (1) having conductive paths (2) formed on a top surface thereof. The first printed overlies the second circuit in a staggered relationship so that an edge thereof lies on the top surface of the second printed circuit. The second printed circuit has a portion protruding beyond this edge. A first set of contact members (13) is formed on the first printed circuit adjacent its edge. A second set of corresponding contact members (14) is formed on the protruding portion of the second printed circuit in opposing relationship to the first set of contact members. A sheet member is fitted over the printed circuits and carries bridging members for establishing electrical contact between corresponding pairs of contact members.
REFERENCES:
patent: 3597660 (1971-08-01), Jenson
patent: 4255613 (1981-03-01), Ketchpel
patent: 4408814 (1983-10-01), Takashi et al.
patent: 5041016 (1991-08-01), Macado et al.
Abrams Neil
Mitel Corporation
Nasri Javaid
LandOfFree
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