Interconnect arrangement for electronic components disposed on a

Details Interconnect arrangement for electronic components disposed on a Interconnect arrangement for electronic components disposed on a

1992-04-24

1994-03-22

Desmond, Eugene F.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

29834, 361767, 361792, H05K 118

Patent

active

052971074

ABSTRACT:
A system and method for interconnecting electronic components on a circuit board that minimize etch lines, minimize stub lengths, reduce the number of vias that are needed, and densely pack electronic components on the circuit board. According to system and method, electronic components are attached to the top planar surface of the circuit board such that adjacent components are rotated 180.degree. in the plane of the top planar surface. These adjacent electronic components also are offset from one another. The electronic components that are attached to the bottom planar surface of the circuit board also have adjacent electronic components rotated 180.degree. in the plane of the bottom planar surface, and are offset. The arrangement of the components disposed at the bottom planar surface is a mirror image of the components disposed at the top planar surface.

REFERENCES:
patent: 4729061 (1988-03-01), Brown
patent: 4868634 (1989-09-01), Ishida et al.
patent: 4891789 (1990-01-01), Quattrini et al.
patent: 5099395 (1992-03-01), Sagisaka et al.

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