Interconnect and cooling system for a semiconductor device

Details Interconnect and cooling system for a semiconductor device Interconnect and cooling system for a semiconductor device

1989-03-27

1990-06-12

James, Andrew J.

357 81, 357 79, H01L 2346

Patent

active

049337475

ABSTRACT:
An interconnect and cooling system has a housing which encloses a semiconductor device which is cooled by a pressurized coolant. The pressurized coolant exerts a force on the semiconductor device and holds it with a constant compressive force against a circuit board. Upon removal of the pressure the housing can be opened to easily and quickly replace the semiconductor device.

REFERENCES:
patent: 4341432 (1982-07-01), Cutchaw
patent: 4381032 (1983-02-01), Cutchaw
patent: 4442450 (1984-04-01), Lipschutz et al.
patent: 4479140 (1984-10-01), Horvath
patent: 4531146 (1985-06-01), Cutchaw
patent: 4581679 (1986-04-01), Smolley
patent: 4612978 (1986-09-01), Cutchaw
patent: 4647959 (1987-03-01), Smith
patent: 4733172 (1988-03-01), Smolley
Horvath, "Cooling Assembly for Solder-Bonded Semiconductor Devices", IBM TDB, vol. 27, No. 7A, Dec./84, p. 3915.
Siwy, Jr. et al, "Thermally Enhanced Semiconductor Chip Packaging Structure", vol. 21, No. 1, 6/78, p. 185.
Stackhouse, "Module with Heat Sink Between Substrate and Circuit Board", vol. 22, No. 4, 9/79, pp. 1428-1429.

Affiliated with

Also associated with

Rating

Interconnect and cooling system for a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect and cooling system for a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect and cooling system for a semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-621282