Interconnect

Details Interconnect Interconnect

2006-08-08

2006-08-08

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S775000, C257S776000, C257S786000, C361S767000, C361S776000, C361S777000, C174S261000, C174S262000

Reexamination Certificate

active

07088002

ABSTRACT:
An interconnect includes a pad and at least two vias coupled to the pad. In one embodiment, the pad has five substantially straight edges, one via directly coupled to the pad by being formed substantially beneath the pad, and one via coupled to one of the five substantially straight edges by a tapered conductive segment. In another embodiment, the pad has three vias directly coupled to the pad and formed substantially beneath the pad. A method of forming an interconnect includes forming at least two vias in a substrate and coupling a pad to each of the at least two vias.

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