Inter-process sensing of wafer outcome

Details Inter-process sensing of wafer outcome Inter-process sensing of wafer outcome

2007-08-14

2007-08-14

Bui, Bryan (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Mechanical measurement system

C702S081000, C700S121000, C438S014000

Reexamination Certificate

active

11126471

ABSTRACT:
A method of monitoring a microelectronic manufacturing process includes the implementation of a monitoring sensor that is configured to operate in an inter-process mode. During an inter-process mode, a first valve is opened in order to initiate transfer of a processing substrate between at least one processing chamber and a transfer chamber. The monitoring sensor is programmed to monitor the interior of the at least one processing chamber only after the first valve is opened.

REFERENCES:
patent: 6251195 (2001-06-01), Wagener et al.
patent: 6279373 (2001-08-01), Kenney et al.
patent: 2003/0033676 (2003-02-01), DeYoung et al.
patent: 62094930 (1987-05-01), None
patent: 10204642 (1998-08-01), None
patent: 2003100620 (2003-04-01), None

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