Inter-pixel thermal isolation for hybrid thermal detectors

Details Inter-pixel thermal isolation for hybrid thermal detectors Inter-pixel thermal isolation for hybrid thermal detectors

1994-04-29

1995-06-13

Fields, Carolyn E.

Radiant energy

Infrared-to-visible imaging

Including detector array

2503383, H04N 533

Patent

active

054245443

ABSTRACT:
A thermal detection system (100, 200) includes a focal plane array (102, 202), a thermal isolation structure (104, 204) and an integrated circuit substrate (106, 206). The focal plane array (102, 202) includes thermal sensors (114, 214) formed from a pyroelectric element (116, 216), such as barium strontium titanate (BST). One side of the pyroelectric element (116, 216) is coupled to a contact pad (110, 210) disposed on the integrated circuit substrate (106, 206) through a mesa strip conductor (112, 212) of the thermal isolation structure (104, 204). The other side of the pyroelectric element (116, 216) is coupled to a common electrode (120, 220). In one embodiment, slots (128) are formed in the common electrode (120) intermediate the thermal sensors (114) to improve inter-pixel thermal isolation. In another embodiment, slots (236) are formed in the optical coating (224) to improve inter-pixel thermal isolation. The common electrode (120, 220) may be formed from a thermally insulating material, such as a silicon monoxide and chromium matrix (cermet) or other metal oxide.

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R. A. Wood, "HIDAD-A Monolithic, Silicon, Uncooled Infrared Imaging Focal Plane Array," HIDAD, date unknown, pp. 579-581.

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