Inter-chip communication

Details Inter-chip communication Inter-chip communication

2004-09-03

2009-11-03

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000, C257S730000, C257SE23001, C257SE23151, C257SE23175

Reexamination Certificate

active

07612443

ABSTRACT:
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

REFERENCES:
patent: 3771219 (1973-11-01), Tuzi et al.
patent: 4868638 (1989-09-01), Hirata et al.
patent: 4990462 (1991-02-01), Sliwa, Jr.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5071363 (1991-12-01), Reylek et al.
patent: 5140745 (1992-08-01), McKenzie, Jr.
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5250847 (1993-10-01), Baskett
patent: 5281852 (1994-01-01), Normington
patent: 5343075 (1994-08-01), Nishino
patent: 5404044 (1995-04-01), Booth et al.
patent: 5404265 (1995-04-01), Moresco et al.
patent: 5482887 (1996-01-01), Duinkerken et al.
patent: 5488765 (1996-02-01), Kubota et al.
patent: 5493769 (1996-02-01), Sakai et al.
patent: 5600101 (1997-02-01), Sakai
patent: 5604328 (1997-02-01), Kubota et al.
patent: 5625221 (1997-04-01), Kim et al.
patent: 5625935 (1997-05-01), Kubota et al.
patent: 5635669 (1997-06-01), Kubota et al.
patent: 5635670 (1997-06-01), Kubota et al.
patent: 5656856 (1997-08-01), Kweon
patent: 5731222 (1998-03-01), Malloy et al.
patent: 5801448 (1998-09-01), Ball
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5854514 (1998-12-01), Roldan et al.
patent: 5877561 (1999-03-01), Kim
patent: 5904496 (1999-05-01), Richards et al.
patent: 5912808 (1999-06-01), Ikemoto
patent: 5953214 (1999-09-01), Dranchak et al.
patent: 5963796 (1999-10-01), Kim
patent: 6002170 (1999-12-01), Kim et al.
patent: 6008530 (1999-12-01), Kano
patent: 6035528 (2000-03-01), Sasaki et al.
patent: 6040235 (2000-03-01), Badehi
patent: 6107179 (2000-08-01), Zomorrodi et al.
patent: 6110823 (2000-08-01), Eldridge et al.
patent: 6121119 (2000-09-01), Richards et al.
patent: RE36916 (2000-10-01), Moshayedi
patent: 6127274 (2000-10-01), Igel et al.
patent: 6151220 (2000-11-01), Sakamoto et al.
patent: 6151775 (2000-11-01), Sakai
patent: 6181560 (2001-01-01), Kim
patent: 6235551 (2001-05-01), Farnworth et al.
patent: 6256880 (2001-07-01), Ulmer et al.
patent: 6268655 (2001-07-01), Farnworth et al.
patent: 6271597 (2001-08-01), Medlen et al.
patent: 6272745 (2001-08-01), Kersten et al.
patent: 6281588 (2001-08-01), Di Stefano et al.
patent: 6287949 (2001-09-01), Mori et al.
patent: 6288627 (2001-09-01), Ulmer
patent: 6316287 (2001-11-01), Zandman et al.
patent: 6320251 (2001-11-01), Glenn
patent: 6351880 (2002-03-01), Palmer et al.
patent: 6369445 (2002-04-01), Khoury
patent: 6379999 (2002-04-01), Tanabe
patent: 6380619 (2002-04-01), Ahiko et al.
patent: 6399419 (2002-06-01), Shibata et al.
patent: 6400006 (2002-06-01), Neu et al.
patent: 6410406 (2002-06-01), Farnworth et al.
patent: 6414374 (2002-07-01), Farnworth et al.
patent: 6441497 (2002-08-01), Han
patent: 6442044 (2002-08-01), Farnworth et al.
patent: 6451705 (2002-09-01), Trapp et al.
patent: D466873 (2002-12-01), Kasem et al.
patent: 6506664 (2003-01-01), Beyne et al.
patent: 6521970 (2003-02-01), Takiar et al.
patent: 6534726 (2003-03-01), Okada et al.
patent: D472528 (2003-04-01), Kasem et al.
patent: 6573157 (2003-06-01), Sato
patent: 6590282 (2003-07-01), Wang et al.
patent: 6635829 (2003-10-01), Ulmer et al.
patent: 6635960 (2003-10-01), Farrar
patent: 6635962 (2003-10-01), Shibata et al.
patent: 6642137 (2003-11-01), Yeh et al.
patent: 6664129 (2003-12-01), Siniaguine
patent: 6680528 (2004-01-01), Matsuo et al.
patent: 6682953 (2004-01-01), Sakai et al.
patent: 6686654 (2004-02-01), Farrar et al.
patent: 6690088 (2004-02-01), MacIntyre
patent: 6691408 (2004-02-01), Biron
patent: 6717275 (2004-04-01), Matsuura et al.
patent: 6727111 (2004-04-01), Tsukada
patent: 6727116 (2004-04-01), Poo et al.
patent: 6735855 (2004-05-01), Akram et al.
patent: D492267 (2004-06-01), Kawajiri et al.
patent: 6751101 (2004-06-01), Sakai
patent: 6760227 (2004-07-01), Sakai et al.
patent: 6768195 (2004-07-01), Drost
patent: 6800505 (2004-10-01), Farnworth et al.
patent: 6808522 (2004-10-01), Richards et al.
patent: 6825547 (2004-11-01), Farnworth et al.
patent: 6828173 (2004-12-01), Farnworth et al.
patent: 6870270 (2005-03-01), Kobrinsky et al.
patent: 6870271 (2005-03-01), Sutherland et al.
patent: 6924551 (2005-08-01), Rumer et al.
patent: 6969907 (2005-11-01), Imai et al.
patent: 6972243 (2005-12-01), Patel
patent: 7030488 (2006-04-01), Kiss
patent: 7086134 (2006-08-01), Dautartas et al.
patent: 7259466 (2007-08-01), Freeman et al.
patent: 7290321 (2007-11-01), Steinberg et al.
patent: 7327022 (2008-02-01), Claydon et al.
patent: 2001/0053565 (2001-12-01), Khoury
patent: 2002/0140084 (2002-10-01), Kimura
patent: 2002/0183721 (2002-12-01), Santini et al.
patent: 2003/0012697 (2003-01-01), Hahn et al.
patent: 2003/0082890 (2003-05-01), Eldridge et al.
patent: 2004/0178496 (2004-09-01), Rapport et al.
patent: 2004/0222518 (2004-11-01), Haba et al.
patent: 2005/0077584 (2005-04-01), Uhland et al.
patent: 2006/0081976 (2006-04-01), Patel
patent: 405865 (1991-01-01), None
patent: 2003222633 (2003-08-01), None
Bass, et al., “Beam Lead Quartz Chips for Superconducting Millimeter-Wave Circuits”, Proc. SPIE vol. 4855, Millimeter and Submillimeter Detectors for Astronomy, Thomas G. Phillips, Jonas Zmuidzinas, Editors, Feb. 2003, pp. 415-426.
S. Kiyono et al., Consideration of Chip Circuit Damages on DCS-FBGA Packages, presented at 52ndElectronic Components and Technology Conferences, May 2002, San Diego, CA.
Wu, L., Wang, Y.P., Hsiao C. S., Innovative Stack-Die Package-S2BGA, presented at 52ndElectronic Components and Technology Conferences, May 2002, San Diego, CA.
M. Sunohara et al., Development of Wafer Thinning and Double-Sided Bumping, presented at 52ndElectronic Components and Technology Conferences, May 2002, San Diego, CA.
Intel Stacked Chip Scale Packaging Products (Nov. 2004), available at hhtp://www.intel.com/design/fIcomp/prodbref/298051.htm.

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