Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1996-12-12
1999-01-26
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
361735, 439328, H05K 710
Patent
active
058632115
ABSTRACT:
An interconnected book-package system permitting the circuit boards within book packages to communicate exclusively of the backplane (e.g., 300). This permits a circuit board that would otherwise have to be constructed from a larger than standard size circuit board and housed within a larger than standard size book package to be formed out of two standard size or smaller circuit boards housed within standard size book package assemblies. This is especially useful to customers seeking upgrade flexibility. The book packages of the interconnected system are connected mechanically and electrically exclusively of the backplane by a connection assembly (e.g., 502, 414, 504, 416) that makes it possible to blindly plug the book packages together. Multi-book latch assemblies include a clip (e.g., 702 and/or 704) used to interconnect the latches on a pair of book packages so that the connected books can be plugged into the backplane as a unit. An electrically conducted gasket is positioned between two connected book packages and around the connection assembly to provide ESD and EMI protection for the interconnected circuit boards. A floating backplane connector relieves the build up of tolerance between book packages of the same pitch and permits such book packages that have been connected together to be connected to a backplane having a difference pitch. Resilient clips (e.g., 500) are also used to join adjacent book packages.
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"Sheet Metal Aluminum Generic Book," Feenstra and Sobotta et al., IBM Technical Disclosure, vol. 33, No. 10B, Mar. 1991, pp. 193-199.
Melville James A.
Sobotta Terry
Abrams Neil
International Business Machines - Corporation
Mutter Michael K.
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