Intelligent wafer handling system and method

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

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31856816, 2941031, 414941, G06F 1900

Patent

active

061673226

ABSTRACT:
A system for handling stiff but flexible discs, particularly semiconductor wafers, is capable of allowing processing on both sides of a wafer. Optical beams are employed to detect a wafer's edge, ascertain a wafer position and determine the size of the wafer. A wafer hand assembly member is slipped under a wafer, or between parallel stacked but spaced wafers, and one or more fingers are rotated 90.degree. to a position perpendicular to the plane of the stiff hand assembly member. The hand assembly also has one or more posts positioned perpendicular to the surface of the hand assembly. The finger(s) and post(s) constitute three upright projections forming the corners of a triangle with the wafer to be grasped there between. A translator solenoid, through an arm, controls the lateral location of one finger or post moving that finger or post toward the other two stationary fingers or post(s) of the translator solenoid, grasping the wafer with controlled traction force between the fixed posts and the moveable finger. The traction force is controlled by the amount of driving energy fed to the translator solenoid. Likewise, methods using the apparatus of the system of the present invention are taught.

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