Intelligent usage of first pass defect data for improved statist

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324765, 438 17, 36446817, 382149, 702 35, G01R 2126, H01L 2166, G06K 900

Patent

active

059990031

ABSTRACT:
A method to accurately classify defects on a semiconductor wafer wherein a scanning tool detects defects and assigns values to parameters that are characteristic of each defect. The values of the characteristic parameters represent a thumbprint of each defect and the defects are placed into "bins" according to the thumbprint of each defect. A sample of defects in each bin is analyzed and assigned a classification code.

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