Intelligent electronic connection socket

Geometrical instruments

Patent

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Details

361401, 361414, H01R 2372

Patent

active

045402264

ABSTRACT:
An electronic connection socket for connecting an electronic package and including a body of nonconductive material, an electronic device fabricated upon a semiconductor substrate located upon the body. The electronic device includes several bonding pads. The socket includes a set of pins to provide interconnection to external electronic devices. The body also includes pin sockets providing interconnection to the electronic package. The pins and pin sockets of the body are also connected to the bonding pads of the electronic device. To provide the electrical interconnection between the electronic package, the electronic device located upon the semiconductor substrate in the socket body and the external circuitry connected to the body.

REFERENCES:
patent: 3340439 (1967-09-01), Henschen et al.
patent: 3512255 (1970-05-01), Hayden et al.
patent: 4342069 (1982-07-01), Link

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