Geometrical instruments
Patent
1983-01-03
1985-09-10
Abrams, Neil
Geometrical instruments
361401, 361414, H01R 2372
Patent
active
045402264
ABSTRACT:
An electronic connection socket for connecting an electronic package and including a body of nonconductive material, an electronic device fabricated upon a semiconductor substrate located upon the body. The electronic device includes several bonding pads. The socket includes a set of pins to provide interconnection to external electronic devices. The body also includes pin sockets providing interconnection to the electronic package. The pins and pin sockets of the body are also connected to the bonding pads of the electronic device. To provide the electrical interconnection between the electronic package, the electronic device located upon the semiconductor substrate in the socket body and the external circuitry connected to the body.
REFERENCES:
patent: 3340439 (1967-09-01), Henschen et al.
patent: 3512255 (1970-05-01), Hayden et al.
patent: 4342069 (1982-07-01), Link
Abbott John H.
Kalidas Navinchandra
Laffitte David S.
Thompson Raymond W.
Abrams Neil
Marshall, Jr. Robert D.
Merrett N. Rhys
Sharp Melvin
Texas Instruments Incorporated
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