Integration type semiconductor device and method for...

Details Integration type semiconductor device and method for... Integration type semiconductor device and method for...

2008-06-17

2009-08-25

Cao, Phat X (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S780000, C257S784000, C257SE23020

Reexamination Certificate

active

07579695

ABSTRACT:
A semiconductor device includes: a plurality of power MOS cells on a semiconductor substrate; a plurality of lead wires connecting to a source and a drain of each power MOS cell through a contact hole; a plurality of collecting electrodes connecting in parallel with the lead wires through a via hole; an interlayer protection film on the collecting electrode; a thick film electrode connecting to the collecting electrode through the opening; and a terminal protection film having an opening for bonding connection. The openings are formed in the interlayer protection film such that a portion between the openings becomes a beam shape.

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