Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2011-01-25
2011-01-25
Everhart, Caridad M (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S667000, C257S745000, C257SE23010, C257SE21597, C257SE21483
Reexamination Certificate
active
07875479
ABSTRACT:
The present invention discloses an integration structure of a semiconductor circuit and microprobe sensing elements and a method for fabricating the same. In the method of the present invention, a semiconductor circuit is fabricated on one surface of a semiconductor substrate, and the other surface of the semiconductor substrate is etched to form a microprobe structure for detect physiological signals. Next, a deposition method is used to sequentially form an electrical isolated layer and an electrical conductive layer on the microprobes. Then, an electrical conductive material is used to electrically connect the electrical conductive layer with the electrical pads of the semiconductor circuit. Thus is achieved the integration of a semiconductor circuit and microprobe sensing elements in an identical semiconductor substrate with the problem of electric electrical isolated being solved simultaneously. Thereby, the voltage level detected by the microprobes will not interfere with the operation of the semiconductor circuit.
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Chang Chih-Wei
Chiou Jin-Chern
Everhart Caridad M
National Chiao Tung University
Rosenberg , Klein & Lee
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