Integration of thermal regulation and electronic fluid sensing

Details Integration of thermal regulation and electronic fluid sensing Integration of thermal regulation and electronic fluid sensing

2006-08-29

2006-08-29

Larkin, Daniel S. (Department: 2856)

Measuring and testing

Gas analysis

Odor

C073S031060, C257S414000, C438S049000

Reexamination Certificate

active

07096716

ABSTRACT:
A fluid sensor device includes a number of components integrated onto a substrate, such as a semiconductor substrate. The integrated components include analyte-detection transducers, signal processing circuitry for manipulating the signals from the transducers, an elevated interconnect scheme, and thermal regulation capability. The substrate is compatible with the use of integrated circuit fabrication techniques. The interconnect scheme enables dense vias that extend generally perpendicular to the surface of the substrate. The transducers are formed on a planarized side of the interconnect scheme opposite to the substrate. Inkjet printing techniques may be used in locating the transducer materials. Alternatively, the transducers may be photosensitive polymers that polymerize when exposed to light.

REFERENCES:
patent: 6018187 (2000-01-01), Theil et al.
patent: 6495892 (2002-12-01), Goodman et al.
patent: 6649993 (2003-11-01), Theil
patent: 6759010 (2004-07-01), Lewis et al.

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