Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2007-04-03
2007-04-03
Lee, Hsien-Ming (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S532000, C257SE27017, C257SE27024
Reexamination Certificate
active
10505258
ABSTRACT:
A band pass filter (114) is formed on an integrated circuit (IC) chip (102). Such band pass filter (114) may be used in a RF or wireless communication device, such as a mobile phone or a personal data assistant (PDA). The band pass filter (114) includes a transformer (202and204) made of a pair of metallic spirals formed on the IC chip. The metallic spirals may have substantially square or rectangular overall shape, and may be fabricated using copper. The metallic spirals may be co-planar and inter-wound or may be stacked, one on top of the other, and separated by a dielectric layer. The transformer (202and204) is capable of receiving an input signal, and providing high pass filtering to the input signal. The band pass filter (114) also includes a capacitor (226, 2; 230and232) that is capable of receiving the input signal and providing low pass filtering in conjunction with an inductance of the transformer (202and204). The band pass filter (114) provides band pass filtering through cascading said high pass and low p filtering.
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International Search Report for International Application No. PCT/US2003/005133, filed Feb. 21, 2003, International Search Report dated May 19, 2003 and mailed Aug. 1, 2003 (3 pgs.).
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Arizona Board of Regents, Acting on behalf of Arizona State Univ
McDonnell Boehnen & Hulbert & Berghoff LLP
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