Measuring and testing – With fluid pressure – Leakage
Reexamination Certificate
2006-10-03
2006-10-03
Noland, Thomas P. (Department: 2856)
Measuring and testing
With fluid pressure
Leakage
C073S040700, C073S052000, C324S691000, C324S724000
Reexamination Certificate
active
07114371
ABSTRACT:
An apparatus for detecting an intrusion of an environmental substance into an environmentally sealed electronic components package. The electronic components package generally includes a plastic coated or plastic enclosed electronic component, that includes a printed circuit board and/or integrated circuits. The intrusion of the environmental substance into the electronic components package can be measured by one of a plurality of monitors. The monitors can detect the presence of the environmental substance and alert a user that a break in the seal of the electronic components package has occurred.
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Dale W. Swanson, Mary C. Chen, Boeing, and Leonard R. Enlow, Electronic Packaging Associates, “Evaluation of Moisture and Stress Sensor Chips in Single-Chip PEMs, Temperature Cycling, THB, HAST, and High-Temperature Storage/Operating Life Tests”, Proceedings of the 1999 IMAPS Conference, Fall 1999. 7 pages by Dec. 1999.
Enlow Len R
Monge Anton B
Swanson Dale W
Harness & Dickey & Pierce P.L.C.
Noland Thomas P.
The Boeing Company
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