Integration of atmospheric intrusion sensors in electronic...

Details Integration of atmospheric intrusion sensors in electronic... Integration of atmospheric intrusion sensors in electronic...

2006-02-14

2006-02-14

Noland, Thomas P. (Department: 2856)

Measuring and testing

With fluid pressure

Leakage

C073S052000, C361S689000

Reexamination Certificate

active

06997043

ABSTRACT:
An apparatus for detecting an intrusion of an environmental substance into an environmentally sealed electronic components package. The electronic components package generally includes a plastic coated or plastic enclosed electronic component, that includes a printed circuit board and/or integrated circuits. The intrusion of the environmental substance into the electronic components package can be measured by one of a plurality of monitors. The monitors can detect the presence of the environmental substance and alert a user that a break in the seal of the electronic components package has occurred.

REFERENCES:
patent: 4050048 (1977-09-01), Frazee
patent: 5606264 (1997-02-01), Licari et al.
patent: 06307968 (1994-11-01), None
patent: 2000162081 (2000-06-01), None
patent: 2000171326 (2000-06-01), None
Euopean Search Report mailed Jan. 10, 2005, 1 page.
Dale W. Swanson, Mary C. Chen, Boeing, and Leonard R. Enlow, Electronic Packaging Associates, “Evaluation of Moisture and Stress Sensor Chips in Single-Chip PEMs, Temperature Cycling, THB, HAST, and High-Temperature Storage/Operating Life Tests”, Proceedings of the 1999 IMAPS Conference, Fall 1999. 7 pages, Dec. 1999.

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