Integrating thermoelectric elements into wafer for heat...

Details Integrating thermoelectric elements into wafer for heat... Integrating thermoelectric elements into wafer for heat...

2007-05-01

2007-05-01

Nguyen, Tuan H. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S717000, C257S720000

Reexamination Certificate

active

10676585

ABSTRACT:
An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bonded bare and active wafers are annealed.

REFERENCES:
patent: 6222113 (2001-04-01), Ghoshal
patent: 6388185 (2002-05-01), Fleurial et al.
patent: 6424533 (2002-07-01), Chu et al.
patent: 6614109 (2003-09-01), Cordes et al.
patent: 2002/0063330 (2002-05-01), Macris
patent: 2005/0045702 (2005-03-01), Freeman et al.

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