Integrating passive components on spacer in stacked dies

Details Integrating passive components on spacer in stacked dies Integrating passive components on spacer in stacked dies

2005-09-13

2005-09-13

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C257S777000

Reexamination Certificate

active

06943294

ABSTRACT:
An embodiment of the present invention is a technique to integrate passive components in a die assembly. A capacitor, inductor, or resistor is integrated on a spacer between upper and lower dies in stacked dies. Conductors are attached to the capacitor, inductor or resistor to connect the capacitor, inductor, or resistor to at least one of the upper and lower dies.

REFERENCES:
patent: 5864177 (1999-01-01), Sundstrom
patent: 6005778 (1999-12-01), Spielberger et al.

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