Integrated wafer transfer mechanism

Details Integrated wafer transfer mechanism Integrated wafer transfer mechanism

2011-07-12

2011-07-12

Mancho, Ronnie (Department: 3664)

Material or article handling

Device for emptying portable receptacle

Nongravity type

C414S431000, C414S422000

Reexamination Certificate

active

07976263

ABSTRACT:
An integrated high speed robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly typically comprises an end effector for moving the object in and out of a chamber, a rotation chuck incorporated on the robot body to provide centering and theta alignment capability, and an optional identification subsystem for identifying the object during transport. The present invention also discloses a transfer robot system, employing a plurality of integrated robot assemblies; a transfer system where a transfer robot system can service a plurality of connected chambers such as FOUP or FOSB; a front end module (FEM); or a sorter system. Through the use of these incorporated capabilities into the moving robot, single object transfer operations can exceed 500 parts per hour.

REFERENCES:
patent: 6126381 (2000-10-01), Bacchi et al.
patent: 6253118 (2001-06-01), Koyama
patent: 7066707 (2006-06-01), Bonora et al.
patent: 7361309 (2008-04-01), Vann et al.
patent: 7578650 (2009-08-01), Aalund et al.
patent: 7607879 (2009-10-01), Hall et al.
patent: 7648327 (2010-01-01), Bonora et al.
patent: 7771151 (2010-08-01), Bonora et al.
patent: 06 124995 (1994-05-01), None
patent: WO 99/17244 (1999-04-01), None
patent: WO 99/52142 (1999-10-01), None
patent: WO 01/40086 (2001-06-01), None
patent: WO 03/021645 (2003-03-01), None
patent: WO 2004/077531 (2004-09-01), None
PCT Search report and written opinion—PCT/IB2008/053825—dated Jul. 22, 2009.

Affiliated with

Also associated with

Rating

Integrated wafer transfer mechanism does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated wafer transfer mechanism, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated wafer transfer mechanism will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2657479