Integrated VCSELs on ASIC module using flexible electrical...

Details Integrated VCSELs on ASIC module using flexible electrical... Integrated VCSELs on ASIC module using flexible electrical...

2005-07-26

2005-07-26

Healy, Brian M. (Department: 2883)

Optical waveguides

Integrated optical circuit

C385S053000, C385S088000, C385S092000, C385S094000, C372S043010, C372S097000, C372S098000, C257S688000, C257S784000, C257S692000, C257S707000, C257S723000, C257S099000, C438S617000, C438S117000, C438S125000

Reexamination Certificate

active

06922496

ABSTRACT:
A circuit module including at least one Application Specific Integrated Circuit (ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array modules is built using a standard ceramic or organic Multi-Chip Module (MCM) package substrate, resulting is a high density device with a small footprint. Interconnection between the electronic devices and the VCSEL array modules is accomplished using standard integrated circuit packaging technology and flexible connectors. Optical connections from the VCSEL arrays to fiber optic cables are made possible by integrating industry-standard optical connectors onto the package. Optical receiver and transceiver modules may also be incorporated into the circuit module.

REFERENCES:
patent: 5978401 (1999-11-01), Morgan
patent: 6334784 (2002-01-01), Howard
patent: 6392296 (2002-05-01), Ahn et al.
patent: 6424530 (2002-07-01), Lee
patent: 6527456 (2003-03-01), Trezza
patent: 6635861 (2003-10-01), Stone
patent: 6709607 (2004-03-01), Hibbs-Brenner et al.
A.F.J. Levi, “Optical Interconnects in Systems”, 2000, pp. 1-8.

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