Semiconductor device manufacturing: process – Chemical etching
Patent
1998-07-17
2000-01-25
Powell, William
Semiconductor device manufacturing: process
Chemical etching
156345, H01L 2144
Patent
active
060178205
ABSTRACT:
An apparatus and method for providing an integrated processing system allowing for the isolation of non-compatible processes used to deposit a material onto a semiconductor wafer and/or remove material from a wafer is described. The integrated processing system of the present invention is comprised of a first processing chamber for processing a substrate in a first environment coupled to a second processing chamber for processing a substrate in a second environment. A connecting interface coupled to the first and second processing chambers allows the first and second processing chambers to be isolated from each other as needed. Further, the connecting interface allows a wafer to be transferred from the first processing chamber to the second processing chamber within a controlled environment. The first and second processing chambers may be or may include cluster tools.
REFERENCES:
patent: 5000827 (1991-03-01), Schuster et al.
patent: 5024746 (1991-06-01), Stierman et al.
patent: 5076205 (1991-12-01), Vowles et al.
patent: 5135608 (1992-08-01), Okutani
patent: 5256274 (1993-10-01), Poris
patent: 5368711 (1994-11-01), Poris
patent: 5429733 (1995-07-01), Ishida
patent: 5437777 (1995-08-01), Kishi
patent: 5441629 (1995-08-01), Kosaki
patent: 5447615 (1995-09-01), Ishida
patent: 5516414 (1996-05-01), Glafenhein et al.
patent: 5830805 (1998-11-01), Schacham-Diamand et al.
patent: 5853559 (1998-12-01), Tamaki et al.
Contolini, R., et al., A Copper Via Plug Process by Electrochemical Planarization, 1993 VMIC Conference-102/93/0470, Jun. 8-9, 1993, pp. 470-477.
Pai, Pei-Lin & Ting, Chiu, Copper as the Future Interconnection Material, 1989 VMIC Conference, TH-0259-2/89/0000-0258, Jun. 12-13, 1989, pp. 258-264.
Contolini, R., et al., Copper Electroplating Process for Sub-Half-Micron ULSI Structures, 1995 VMIC Conference--104/95/0322, Jun. 27-29, 1995, pp. 322-328.
Ting, Chiu H., et al., Recent Advances in Cu Metallization, 1996 VMIC Conference, 106/96/0481(c), Jun. 18-20, 1996, pp. 481-486.
Contolini, Robert J., et al., Electrochemical Planarization for Multilevel Metallization, J. Electrochem. Soc., vol. 141, No. 9, Sep. 1994, pp. 2503-2510.
Equinox--Single Substrate Processing System, A Semitool Brochure, EQU025-Apr. 94, pp. 1.8-8.8.
Holtkamp William H.
Ting Chiu H.
Cutek Research, Inc.
Powell William
LandOfFree
Integrated vacuum and plating cluster system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated vacuum and plating cluster system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated vacuum and plating cluster system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2315655