Integrated thin film capacitor/inductor/interconnect system...

Details Integrated thin film capacitor/inductor/interconnect system... Integrated thin film capacitor/inductor/interconnect system...

2006-02-14

2006-02-14

Schillinger, Laura M (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S532000, C257S531000

Reexamination Certificate

active

06998696

ABSTRACT:
A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed method first employs a thin metal layer (0502) deposited and patterned on the substrate (0501). This thin patterned layer (0502) is used to provide both lower electrodes for capacitor structures (0603) and interconnects (0604) between upper electrode components. Next, a dielectric layer (0705) is deposited over the thin patterned layer (0502) and the dielectric layer (0705) is patterned to open contact holes (0806) to the thin patterned layer. The upper electrode layers (0907, 0908, 1009, 1010) are then deposited and patterned on top of the dielectric (0705).

REFERENCES:
patent: 3969197 (1976-07-01), Tolar et al.
patent: 4002542 (1977-01-01), Young
patent: 4002545 (1977-01-01), Fehiner et al.
patent: 4038167 (1977-07-01), Young
patent: 4062749 (1977-12-01), Young
patent: 4364099 (1982-12-01), Koyama et al.
patent: 4408254 (1983-10-01), Chu et al.
patent: 4410867 (1983-10-01), Arcidiacono et al.
patent: 4423087 (1983-12-01), Howard et al.
patent: 4471405 (1984-09-01), Howard et al.
patent: 4599678 (1986-07-01), Wertheimer et al.
patent: 4631633 (1986-12-01), Shaulov et al.
patent: 5122923 (1992-06-01), Matsubara et al.
patent: 5258886 (1993-11-01), Murayama et al.
patent: 5262920 (1993-11-01), Sakuma et al.
patent: 5338950 (1994-08-01), Bahl
patent: 5382817 (1995-01-01), Kashihara et al.
patent: 5390072 (1995-02-01), Anderson et al.
patent: 5436477 (1995-07-01), Hashizume et al.
patent: 5455064 (1995-10-01), Chou et al.
patent: 5539613 (1996-07-01), Yamamichi et al.
patent: 5587870 (1996-12-01), Anderson et al.
patent: 5643804 (1997-07-01), Arai et al.
patent: 5670408 (1997-09-01), Yamamichi et al.
patent: 5685968 (1997-11-01), Hayakawa et al.
patent: 5693595 (1997-12-01), Talisa et al.
patent: 5699224 (1997-12-01), Hanamura et al.
patent: 5708302 (1998-01-01), Azuma et al.
patent: 5736448 (1998-04-01), Saia et al.
patent: 5737179 (1998-04-01), Shaw et al.
patent: 5741722 (1998-04-01), Lee
patent: 5745335 (1998-04-01), Watt
patent: 5760432 (1998-06-01), Abe et al.
patent: 5767564 (1998-06-01), Kunimatsu et al.
patent: 5781081 (1998-07-01), Arakawa et al.
patent: 5789323 (1998-08-01), Taylor
patent: 5818079 (1998-10-01), Noma et al.
patent: 5822175 (1998-10-01), Azuma
patent: 5872040 (1999-02-01), Wojnarowski et al.
patent: 5874379 (1999-02-01), Joo et al.
patent: 5877533 (1999-03-01), Arai et al.
patent: 5882946 (1999-03-01), Otani
patent: 5883781 (1999-03-01), Yamamichi et al.
patent: 5889299 (1999-03-01), Abe et al.
patent: 5907470 (1999-05-01), Kita et al.
patent: 5912044 (1999-06-01), Farooq et al.
patent: 5936831 (1999-08-01), Kola et al.
patent: 5943547 (1999-08-01), Yamamichi et al.
patent: 5955774 (1999-09-01), Kang
patent: 5973908 (1999-10-01), Saia et al.
patent: 5973911 (1999-10-01), Nishioka
patent: 5982018 (1999-11-01), Wark et al.
patent: 6001702 (1999-12-01), Cook et al.
patent: 6023407 (2000-02-01), Farooq et al.
patent: 6023408 (2000-02-01), Schaper
patent: 6040594 (2000-03-01), Otani
patent: 6069388 (2000-05-01), Okusa et al.
patent: 6072205 (2000-06-01), Yamaguchi et al.
patent: 6075691 (2000-06-01), Duenas et al.
patent: 6078093 (2000-06-01), Lee
patent: 6081417 (2000-06-01), Matsuki
patent: 6096600 (2000-08-01), Azami
patent: 6761963 (2004-07-01), Casper et al.
patent: 6890629 (2005-05-01), Casper et al.
patent: 2002/0089810 (2002-07-01), Casper et al.
patent: 2003/0030965 (2003-02-01), Chua et al.
patent: 2004/0080021 (2004-04-01), Casper et al.
patent: 2004/0081811 (2004-04-01), Casper et al.
patent: 2005/0162236 (2005-07-01), Casper et al.
patent: 2005/0175938 (2005-08-01), Casper et al.
Marc De Samber, Nick Pulsford, Marc Van Delden, Robert Milsom; “Low-Complexity MCM-D Technology with Integrated Passives for High Frequency Applications”, The International Journal of Microcircuits and Electronic Packaging, vol. 21, No. 2, Second Quarter 1998, pp. 224-229 (ISSN 1063-1674) (International Microelectronics and Packaging Society) [6 pages].

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