Integrated thermal unit having a shuttle with a temperature...

Details Integrated thermal unit having a shuttle with a temperature... Integrated thermal unit having a shuttle with a temperature...

2007-10-16

2007-10-16

Paik, Sang (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C414S935000

Reexamination Certificate

active

11174988

ABSTRACT:
An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.

REFERENCES:
patent: 4718975 (1988-01-01), Bowling et al.
patent: 4985722 (1991-01-01), Ushijima et al.
patent: 5651823 (1997-07-01), Parodi et al.
patent: 6467976 (2002-10-01), Matsuyama et al.
patent: 6499777 (2002-12-01), Wang
patent: 6515731 (2003-02-01), Akimoto
patent: 6639189 (2003-10-01), Ramanan et al.
patent: 6814507 (2004-11-01), Inagaki
Office Action for U.S. Appl. No. 11/174,781 (Sep. 11, 2006).
Office Action for U.S. Appl. No. 11/174,782 (Sep. 11, 2006).

Affiliated with

Also associated with

Rating

Integrated thermal unit having a shuttle with a temperature... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated thermal unit having a shuttle with a temperature..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated thermal unit having a shuttle with a temperature... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3893623