Integrated thermal coupling for heat generating device

Details Integrated thermal coupling for heat generating device Integrated thermal coupling for heat generating device

1997-11-14

1999-09-07

Picardat, Kevin M.

Chemistry: analytical and immunological testing

Sulfur containing

Sulfur dioxide

438121, 257722, H01L 2144

Patent

active

059486899

ABSTRACT:
In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed in the first side surface. A plurality of first channels are etched in the second side surface to form a plurality of first fins. A second substrate has a plurality of second channels etched therein to form a plurality of second fins and a base. The base is for thermally engaging with a heat sink. The first and second fins providing a thermally conductive path from the heat generating devices to the heat sink when interleaved with each other.

REFERENCES:
patent: 3384341 (1968-05-01), Bimshas, Jr. et al.
patent: 4800956 (1989-01-01), Hamburgen
patent: 5083373 (1992-01-01), Hamburgen
patent: 5609202 (1997-03-01), Anderson et al.
patent: 5838065 (1998-11-01), Hamburgen et al.
IEEE, 1991, 0569-5503/91/0000-0693, "Hardware Technology for Hitachi M-880 Electronic Components & Technology Conference, Atlanta, Georgia!, pp. i-13.
"Interleaved Fin Thermal Connectors for Multichip Modules", W. Hamburgen, WRL Research Report Sep. 1991, Aug. 1991, Digital Equipment Corporation, Western Research Lab, 250 University Ave., Palo Alto, California 94301 USA, pp. 1-8.

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