Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1979-11-20
1982-01-26
Smith, John D.
Metal working
Method of mechanical manufacture
Assembling or joining
156644, 156647, 156653, 156662, 156664, 156665, 156901, 427 96, 29591, H01L 21603
Patent
active
043121179
ABSTRACT:
A semiconductor integrated circuit device of the beam lead type having a semiconductor interconnection substrate with apertures for integrated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers over the bonding pads of the chips and for making electrical connection thereto. Devices thus produced may be assembled and tested and failed chips replaced as necessary before the chips are ultrasonically welded to the interconnection metallization and before final fabrication of the device. The invention also includes a method for producing an interconnection substrate in which a plurality of conically shaped holes are etched into a semiconductor wafer having sharp points within the body of the wafer. A metal layer is deposited over the surface of the semiconductor wafer filling the etched holes. Sharp points are thus formed on the metal in the etched holes. Apertures are then etched in the semiconductor wafer and the metal layer etched as required to provide sharply pointed connecting probes suspended above apertures in the semiconductor wafer.
REFERENCES:
patent: 3493820 (1970-02-01), Rosvold
patent: 3795043 (1974-03-01), Forlani
patent: 3888708 (1975-06-01), Wise
patent: 4180422 (1979-12-01), Rosvold
patent: 4189825 (1980-02-01), Robillard
Michals Robert L.
Robillard David R.
Bartlett Milton D.
Pannone Joseph D.
Raytheon Company
Smith John D.
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