Integrated system for processing semiconductor wafers

Details Integrated system for processing semiconductor wafers Integrated system for processing semiconductor wafers

2006-06-13

2006-06-13

Eley, Timothy V. (Department: 3724)

Abrading

Abrading process

With critical nonabrading work treating

C451S067000

Reexamination Certificate

active

07059944

ABSTRACT:
An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

REFERENCES:
patent: 5620578 (1997-04-01), Hurwitt
patent: 5679059 (1997-10-01), Nishi et al.
patent: 5826129 (1998-10-01), Hasebe et al.
patent: 5827110 (1998-10-01), Yajima et al.
patent: 5830045 (1998-11-01), Togawa et al.
patent: 5885138 (1999-03-01), Okumura et al.
patent: 5954072 (1999-09-01), Matusita
patent: 5972110 (1999-10-01), Akimoto
patent: 6110011 (2000-08-01), Somekh et al.
patent: 6122566 (2000-09-01), Nguyen et al.
patent: 6132289 (2000-10-01), Labunsky et al.
patent: 6136163 (2000-10-01), Cheung et al.
patent: 6224638 (2001-05-01), Jevtic et al.
patent: 6251759 (2001-06-01), Guo et al.
patent: 6368880 (2002-04-01), Singhvi et al.
patent: 6409576 (2002-06-01), Oguri et al.
patent: 6468022 (2002-10-01), Whitcomb
patent: 6494985 (2002-12-01), Sotozaki et al.
patent: 6578853 (2003-06-01), Treur et al.
patent: 6613200 (2003-09-01), Li et al.
patent: 6736929 (2004-05-01), Komandur et al.
patent: 6857838 (2005-02-01), Kuroda
patent: 0 978 867 (2000-02-01), None
patent: 1 037 263 (2000-09-01), None
patent: WO 200229861 (2002-04-01), None

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