Integrated system for processing semiconductor wafers

Details Integrated system for processing semiconductor wafers Integrated system for processing semiconductor wafers

2005-10-11

2005-10-11

Eley, Timothy V. (Department: 3724)

Abrading

Machine

Combined

C451S288000, C451S339000

Reexamination Certificate

active

06953392

ABSTRACT:
An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem includes a process chamber and a cleaning chamber. The system also has a wafer handling subsystem for transporting each of the wafers into or out of the appropriate one of the plurality of processing subsystems. The plurality of processing subsystems and wafer handling subsystem form an integrated system.

REFERENCES:
patent: 5826129 (1998-10-01), Hasebe et al.
patent: 5830045 (1998-11-01), Togawa et al.
patent: 5885138 (1999-03-01), Okumura et al.
patent: 5972110 (1999-10-01), Akimoto
patent: 6110011 (2000-08-01), Somekh et al.
patent: 6136163 (2000-10-01), Cheung et al.
patent: 6258223 (2001-07-01), Cheung et al.
patent: 6494985 (2002-12-01), Sotozaki et al.
patent: 6613200 (2003-09-01), Li et al.
patent: 0 978 867 (2000-02-01), None
patent: 1 037 263 (2000-09-01), None

Affiliated with

Also associated with

Rating

Integrated system for processing semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated system for processing semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated system for processing semiconductor wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3465955