Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2006-09-05
2006-09-05
Smith, Bradley K. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S296000, C257S301000, C257S305000, C257SE29001, C438S243000, C438S386000, C361S306200
Reexamination Certificate
active
07102204
ABSTRACT:
The invention provides a fingered decoupling capacitor in the bulk silicon region that are formed by etching a series of minimum or sub-minimum trenches in the bulk silicon region, oxidizing these trenches, removing the oxide from at least one or more disjoint trenches, filling all the trenches with either in-situ doped polysilicon, intrinsic polysilicon that is later doped through ion implantation, or filling with a metal stud, such as tungsten and forming standard interconnects to the capacitor plates.
REFERENCES:
patent: 5206787 (1993-04-01), Fujioka
patent: 5304506 (1994-04-01), Porter et al.
patent: 5661340 (1997-08-01), Ema et al.
patent: 5688709 (1997-11-01), Rostoker
patent: 5759907 (1998-06-01), Assaderaghi et al.
patent: 5770875 (1998-06-01), Assaderaghi et al.
patent: 5789289 (1998-08-01), Jeng
patent: 5872697 (1999-02-01), Christensen et al.
patent: 6015729 (2000-01-01), Shirley et al.
patent: 6081008 (2000-06-01), Rostoker
patent: 6096584 (2000-08-01), Ellis-Monaghan et al.
patent: 6124163 (2000-09-01), Shirley et al.
patent: 6188122 (2001-02-01), Davari et al.
patent: 6303457 (2001-10-01), Christensen et al.
patent: 6337253 (2002-01-01), Davari et al.
patent: 6475838 (2002-11-01), Bryant et al.
patent: 6492244 (2002-12-01), Christensen et al.
patent: 6552381 (2003-04-01), Chittipeddi et al.
patent: 6608365 (2003-08-01), Li et al.
patent: 6963483 (2005-11-01), Chakravorty et al.
patent: 2002/0036322 (2002-03-01), Divakauni et al.
patent: 2002/0064913 (2002-05-01), Adkisson et al.
patent: 2003/0094654 (2003-05-01), Christensen et al.
Berndlmaier Zachary E.
Kiewra Edward W.
Radens Carl J.
Tonti William R.
Fulk Steven J.
Gibb I.P. Law Firm LLC
Pepper, Esq. Margaret A.
LandOfFree
Integrated SOI fingered decoupling capacitor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated SOI fingered decoupling capacitor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated SOI fingered decoupling capacitor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3528232