1987-05-08
1991-01-01
Hille, Rolf
357 80, 357 68, 357 69, H01L 2312, H01L 2314, H01L 2348
Patent
active
049822675
ABSTRACT:
An integrated semiconductor package comprising a semiconductor body having a first surface and a plurality of pins, each pin having first and second ends. Also disclosed is an apparatus for connecting the first end of each pin to the first surface of the semiconductor body so that the semiconductor body provides the physical integrity to support the pins above and substantially perpendicular to the first surface. The apparatus of connecting the first end of each pin to the first surface comprises a plurality of metalization interconnects. A metalization interconnect is interspaced between the first end of each pin and the first surface of the semiconductor body. The pins are arranged in an array so that the second end of each pin can be removably inserted into a pin-grid socket.
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Mones Arthur H.
Sheehy Xavier
Spielberger Richard K.
Atmel Corporation
Clark S. V.
Hille Rolf
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