Integrated semiconductor laser device

Details Integrated semiconductor laser device Integrated semiconductor laser device

1995-06-22

1997-09-16

Davie, James W.

Coherent light generators

Particular temperature control

Heat sink

372109, H01S 304

Patent

active

056688229

ABSTRACT:
A method of fabricating an integrated semiconductor laser device includes preparing a polygonal heat sink having side surfaces, and die-bonding semiconductor laser chips to the side surfaces of the heat sink. Therefore, the semiconductor laser chips are accurately arranged at such positions that laser beams emitted from these laser chips are parallel to each other and partially overlap each other. In addition, the semiconductor laser chips are integrated without unwanted contact of a conductive material used for the die-bonding to an active layer exposed at a facet of each laser chip. Further, since the complicated process of die-bonding a laser chip on another laser chip is dispensed with, the fabricating method is easily automated.

REFERENCES:
patent: 5022035 (1991-06-01), Hasegawa
patent: 5504349 (1996-04-01), Yoshino

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