Integrated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

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C257S687000, C257S723000, C257SE23003

Reexamination Certificate

active

08008760

ABSTRACT:
An integrated semiconductor device includes a plurality of semiconductor elements having different integrated element circuits or different sizes; an insulating material arranged between the semiconductor elements; an organic insulating film arranged entirely on the semiconductor elements and the insulating material; a fine thin-layer wiring that arranged on the organic insulating film and connects the semiconductor elements; a first input/output electrode arranged on an area of the insulating material; and a first bump electrode formed on the first input/output electrode.

REFERENCES:
patent: 6507098 (2003-01-01), Lo et al.
patent: 6836025 (2004-12-01), Fujisawa et al.
patent: 6856009 (2005-02-01), Bolken et al.
patent: 7518229 (2009-04-01), Cotte et al.
patent: 2007/0273018 (2007-11-01), Onozuka et al.
patent: 2008/0318356 (2008-12-01), Onozuka et al.
patent: 1463043 (2003-12-01), None
patent: 2001-189424 (2001-07-01), None
patent: 2003-298005 (2003-10-01), None
patent: 2005-167191 (2005-06-01), None
patent: 2005-268453 (2005-09-01), None
patent: 2006-245226 (2006-09-01), None
patent: 2007-260866 (2007-10-01), None
patent: WO00/21135 (2000-04-01), None
U.S. Appl. No. 12/350,927, filed Jan. 8, 2009, Unknown.

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