Integrated semiconductor circuit with decoupled D.C. wiring

Details Integrated semiconductor circuit with decoupled D.C. wiring Integrated semiconductor circuit with decoupled D.C. wiring

1990-02-16

1991-04-16

Jackson, Jr., Jerome

357 51, 357 65, 357 45, 357 68, 357 236, H01L 2944

Patent

active

050087312

ABSTRACT:
An integrated semiconductor circuit, in which the D.C. part of the wiring containing only D.C. information lies on a part of the insulating layer located on the surface which is considerably thinner than the parts of the insulating layer under wiring parts not forming part of the D.C. wiring. Preferably, for this purpose a substrate contact diffusion connected to a reference potential is provided under the D.C. wiring parts. As a result, H.F. interference signals on the D.C. wiring are reduced so that noise and distortion are considerably reduced.

REFERENCES:
patent: 4613883 (1986-09-01), Tihanyi
patent: 4646126 (1987-02-01), Iizuka
patent: 4654689 (1987-03-01), Fujii
patent: 4656058 (1987-04-01), Dwyer
patent: 4737830 (1988-04-01), Patel et al.
patent: 4785202 (1988-11-01), Toyoda
patent: 4796084 (1989-01-01), Kamasaki et al.

Affiliated with

Also associated with

Rating

Integrated semiconductor circuit with decoupled D.C. wiring does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated semiconductor circuit with decoupled D.C. wiring, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated semiconductor circuit with decoupled D.C. wiring will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-425010