Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-12-28
2000-05-02
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257673, 257666, 257698, 257693, 257797, 257787, H01L 2348, H01L 23495, H01L 2328
Patent
active
060575956
ABSTRACT:
The integrated semiconductor circuit has a semiconductor chip, a housing that accommodates the semiconductor chip, and a lead frame that connects the contact areas of the semiconductor chip and forms external terminals of the integrated semiconductor circuit. The conductors of the lead frame are sunk, in the regions of the housing in which the distance between the edge of the housing and the semiconductor chip is relatively large, to the central plane of the housing, with the result that the conductors of the lead frame have depressions in those regions.
REFERENCES:
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5760471 (1998-06-01), Fujisawa et al.
patent: 5866939 (1999-02-01), Shin et al.
Golz Bruno
Pohl Jens
Widner Harald
Greenberg Laurence A.
Lerner Herbert L.
Siemens Aktiengesellschaft
Stemer Werner H.
Williams Alexander Oscar
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