Integrated semiconductor circuit having a multilayer wiring

Details Integrated semiconductor circuit having a multilayer wiring Integrated semiconductor circuit having a multilayer wiring

1989-07-20

1990-02-20

Hille, Rolf

357 68, H01L 2354, H01L 2348

Patent

active

049031163

ABSTRACT:
In integrated semiconductor circuits having multilayer wiring, in which the circuit elements formed in the semiconductor body are interconnected by connection conductors which extend at at least two levels located one above the other and are mutually separated by insulating layers, undesired couplings may occur between the circuit elements and the conductor tracks extending above them. These disturbing couplings can be avoided by having at least one connection conductor of a lower wiring level so positioned and shaped and connected to such a potential that it constitutes a screening element between at least one underlying circuit element and at least one connection conductor at an upper wiring level.

REFERENCES:
patent: 3879840 (1975-04-01), Ames et al.
patent: 3946420 (1976-03-01), Hartsell
patent: 3946421 (1976-03-01), Hartsell et al.
patent: 4012767 (1977-03-01), Brown et al.
patent: 4484212 (1984-11-01), Konatsu et al.
patent: 4491860 (1985-01-01), Lim
patent: 4587549 (1986-05-01), Ushiku
patent: 4694320 (1987-09-01), Asaro
patent: 4746965 (1988-05-01), Nishi

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