Integrated semiconductor circuit having a logic and power...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including high voltage or high power devices isolated from...

Reexamination Certificate

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C257S750000, C257S775000

Reexamination Certificate

active

07132726

ABSTRACT:
An integrated semiconductor circuit having a first and a second portion of a substrate, in which a power semiconductor circuit structure and a logic circuit structure are respectively formed. The metallization having a power metal layer and an in relative terms thinner logic metal layer, the two metal layers being located directly above one another in this order, without an intermetal dielectric between them, only in the first portion above the power semiconductor circuit structure, and an uninterrupted conductive barrier layer being located at least between the power metal layer and the intermediate oxide layer and also between the power metal layer and the contact regions and electrode portions of the power semiconductor circuit structure which it contact-connects, and to a method for fabricating it.

REFERENCES:
patent: 4718977 (1988-01-01), Contiero et al.
patent: 4807007 (1989-02-01), Borrello et al.
patent: 6020640 (2000-02-01), Efland et al.
patent: 2001/0018257 (2001-08-01), Mathews

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