Wave transmission lines and networks – Coupling networks – Balanced to unbalanced circuits
Reexamination Certificate
2005-04-19
2005-04-19
Pascal, Robert (Department: 2817)
Wave transmission lines and networks
Coupling networks
Balanced to unbalanced circuits
C336S200000
Reexamination Certificate
active
06882240
ABSTRACT:
A transmission line element is formed in an integrated circuit chip. The transmission line element includes a plurality of parallel conductors, with each conductor including a plurality of electrically connected transmission lines. At least two of the transmission lines of each conductor are in different ones of plural metal layers of the integrated circuit chip. The metal layers are separated by at least one dielectric layer. Each transmission line in each conductor is edge-coupled to a transmission line of another of the conductors, and broadside-coupled to a transmission line of another of the conductors. The transmission line element can be used, for example, to fabricate various types of balanced and unbalanced transformers.
REFERENCES:
patent: 4992769 (1991-02-01), Oppelt
patent: 4999597 (1991-03-01), Gaynor
patent: 5146191 (1992-09-01), Mandai et al.
patent: 5200718 (1993-04-01), Kato
patent: 5430424 (1995-07-01), Sato et al.
patent: 5497137 (1996-03-01), Fujiki
patent: 5767753 (1998-06-01), Ruelke
patent: 5793272 (1998-08-01), Burghartz et al.
patent: 5852866 (1998-12-01), Kuettner et al.
patent: 5877667 (1999-03-01), Wollesen
patent: 5884990 (1999-03-01), Burghartz et al.
patent: 5892668 (1999-04-01), Okamoto et al.
patent: 5969590 (1999-10-01), Gutierrez
patent: 6097273 (2000-08-01), Frye et al.
patent: 6198374 (2001-03-01), Abel
patent: 6263198 (2001-07-01), Li
patent: 6278340 (2001-08-01), Liu
patent: 6317965 (2001-11-01), Okamoto et al.
patent: 6396362 (2002-05-01), Mourant et al.
patent: 6407647 (2002-06-01), Apel et al.
patent: 6437658 (2002-08-01), Apel et al.
patent: 1037300 (2000-09-01), None
Engels, M., and Jansen, R. H., “A Novel Compact Balun Structure for Multilayer MMICs,” 26thEuMC, Sep. 9-12, 1996, Hotel Hilton Atrium, Prague, Czech Republic, pp. 692-696.
Brown et al. “Printed Microwave Couplers With Thermal Isolation,” 1997 IEEE MTT-S International Microwave Symposium Digest; Denver, Jun. 8-13, 1997, IEEE vol. 2, pp. 983-986.
Toyoda, Ichihiko, et al. “Three-Dimensional MMIC and Its Application: An Ultra-Wideband Miniature Balun,” IEICE Trans. Electron., vol. E78-C, No. 8, Aug. 1995, pp. 919-924.
Engels, M., and Jansen, R. H., “Modeling and Design of Novel Passive MMIC Components With Three and More Conductor Levels,” 1994 IEEE MTT-S Digest (1994), pp. 1293-1296.
Cho, Choonsik, et al. “A New Design Procedure for Single-Layer and Two-Layer Three-Line Baluns,” IEEE Transactions on Microwave Theory and Techniques, vol. 46, No. 12, Dec. 1998, pp. 2514-2519.
Bever Hoffman & Harms
Pascal Robert
Takaoka Dean
Triquint Semiconductor, Inc.
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