Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
1999-06-16
2001-08-07
Lateef, Marvin M. (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S185000, C174S016300, C257S722000, C361S697000, C361S704000
Reexamination Certificate
active
06269863
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention is related to mounting mechanisms for computer processors. Computer processors typically are housed within an assembly that includes a thermal plate which is in thermal contact with the computer processor. As computer processors are designed to become faster and faster, they likewise tend to generate increased amounts of heat. In order to assist in dissipating heat, a heat sink is mounted in thermal contact with the thermal plate of the computer processor assembly. Another concern that will be encountered as computer processors become faster is the effects of electromagnetic interference (EMI). EMI will shortly become a major hurdle for manufacturers as processor speeds reach 500 MHz.
A conventional motherboard design for a Pentium II processor assembly includes a printed circuit board with a slot connector fixed thereon. The slot connector includes an elongated slot for engagement with a connector on the computer processor board. The computer processor board is housed in an assembly typically referred to as a cartridge. Some Pentium II processor assemblies are designed for mounting on a printed circuit board with the computer processor board oriented perpendicular to the printed circuit board. A retention mechanism is fastened to the printed circuit board straddling the slot connector and providing vertical struts into which the Pentium II processor cartridge slides for securing the processor to the motherboard. A heat sink is typically mounted onto the thermal plate. A support base may be provided on the motherboard to help support the weight of the heat sink extending out from the thermal plate.
SUMMARY OF THE INVENTION
The present invention relates to an integrated heat sink and retention mechanism. An embodiment of the invention is a method for mounting, a processor assembly on a circuit board using an integrated heat sink/retention mechanism. The integrated heat sink/retention mechanism is attached to the processor assembly so as to establish thermal contact between the flat surface of the heat sink and the flat surface of the processor assembly. The integrated heat sink/retention mechanism is mounted on the circuit board so as to hold the flat surface of the processor assembly fixed perpendicularly relative to the circuit board. It may thus be unnecessary for a motherboard manufacturer to locate, purchase and mount a separate retention mechanism and heat sink for each processor assembly to be mounted on a board.
In accordance with a further embodiment of the method of the present invention, a heat sink is attached to the processor assembly. The heat sink is mounted on the circuit board by making a grounding connection between the heat sink and the circuit board. This method creates an electromagnetic interference shield using the same steps required to assemble a heat sink and processor assembly on a circuit board. The heat sink for use in these methods may be any of a number of types that provide ample surface area for dissipation of heat. For example, the heat sink may be a corrugated thermally conductive sheet clamped to a thermally conductive base plate. Alternatively, the heat sink may be a device with a flat surface on one side and a plurality of heat conductive surfaces projecting out of the opposite side forming a plurality of air passageways. The heat sink may be provided with at least one mounting extension for fastening to the circuit board.
An embodiment of the integrated heat sink/retention mechanism of the present invention includes a heat sink and a mechanism for attaching the heat sink to a processor assembly. A mount connected to the heat sink is used to securely mount the heat sink on a circuit board so as to orient the processor assembly perpendicular to the circuit board. The mount connected to the heat sink may be a mounting extension that is integral with the heat sink. The mounting extension and heat sink may provide an electrically conductive path from the heat generating processor assembly to the mounting extension. The mounting extension may be a plurality of legs with feet that are insertable into retention slots attached to a circuit board. Alternatively, the mounting extensions may be fastenable directly to the circuit board.
A motherboard of an embodiment of the invention includes a slot connector having an elongated slot and a plurality of retention slots. The retention slots may be in contact with a grounding plane such that the heat sink provides an electrically grounded path to the thermal plate of the processor assembly. With the heat sink serving as the retention mechanism for the processor assembly, fewer parts need to be purchased and assembled in the formation of a motherboard.
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Lateef Marvin M.
McKinnon Terrell
Molex Incorporated
Zeitler Robert J.
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