Integrated placement and soldering pickup head and method of usi

Details Integrated placement and soldering pickup head and method of usi Integrated placement and soldering pickup head and method of usi

1997-07-01

2000-01-25

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

22818021, 228212, 228232, B23K 3500

Patent

active

060169494

ABSTRACT:
A pickup head adapted to pick up an electronic component from a supply source, support the component during transport from the supply source to a substrate, and position the electronic component at a site on the substrate has a means for heating the electronic component during pickup, transport and positioning the chip, to a temperature sufficient to effect solder reflow when the electronic component is placed on the substrate. The pickup head, and method of using the head, effectively reduce the problems associated heretofore with solder reflow attachment of individual components by reducing the number of process steps, faster attachment cycle times, and reduced manufacturing costs.

REFERENCES:
patent: 3453714 (1969-07-01), Clark et al.
patent: 3499203 (1970-03-01), Clark et al.
patent: 3791018 (1974-02-01), Johnston et al.
patent: 4160893 (1979-07-01), Meyen et al.
patent: 4501064 (1985-02-01), DiNozzi et al.
patent: 4610388 (1986-09-01), Koltuniak et al.
patent: 4696101 (1987-09-01), Vanzetti et al.
patent: 4756077 (1988-07-01), Bianchi
patent: 4788403 (1988-11-01), Hayakawa et al.
patent: 4828162 (1989-05-01), Donner et al.
patent: 4967950 (1990-11-01), Legg et al.
patent: 4979664 (1990-12-01), Lyons et al.
patent: 4984731 (1991-01-01), Imamura
patent: 5010227 (1991-04-01), Todd
patent: 5023426 (1991-06-01), Prokosch et al.
patent: 5029383 (1991-07-01), Snyder et al.
patent: 5033665 (1991-07-01), Todd
patent: 5060288 (1991-10-01), Spigarelli et al.
patent: 5084962 (1992-02-01), Takahashi et al.
patent: 5150827 (1992-09-01), Fries
patent: 5211325 (1993-05-01), Schweizer et al.
patent: 5262355 (1993-11-01), Nishiguchi et al.
patent: 5349500 (1994-09-01), Casson et al.
patent: 5377405 (1995-01-01), Sakurai et al.
patent: 5379514 (1995-01-01), Okuda et al.
patent: 5482198 (1996-01-01), Kohn
patent: 5483421 (1996-01-01), Gedney et al.
patent: 5526974 (1996-06-01), Gordon et al.
patent: 5613632 (1997-03-01), Kohn
patent: 5639011 (1997-06-01), Jacks et al.
patent: 5735450 (1998-04-01), Heim et al.
patent: 5785237 (1998-07-01), Lasto et al.

Affiliated with

Also associated with

Rating

Integrated placement and soldering pickup head and method of usi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated placement and soldering pickup head and method of usi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated placement and soldering pickup head and method of usi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2310787