Integrated patch antenna and electronics assembly and method...

Details Integrated patch antenna and electronics assembly and method... Integrated patch antenna and electronics assembly and method...

2006-04-18

2006-04-18

Nguyen, Hoang V. (Department: 2821)

Communications: radio wave antennas

Antennas

Microstrip

C343S846000

Reexamination Certificate

active

07030815

ABSTRACT:
An integrated patch antenna and electronics assembly (300) comprises an antenna dielectric layer (305), a ground plane layer (310) disposed on a first side of the antenna dielectric layer, a printed circuit dielectric layer (315) disposed on the ground plane layer opposite the antenna dielectric layer, a patterned conductive metal foil layer (320) on a component surface (323) of the assembly (300), and a conductive metal foil antenna patch (325) disposed on a second side of the antenna dielectric layer that is in a patch side (391) of the assembly. In some embodiments, a plated through hole (330) couples the antenna patch to the patterned conductive metal foil layer. In some embodiments, there are one or more printed circuit dielectric layers (316, 341, 346, 351) disposed over the antenna patch on the antenna patch side of the assembly. In some embodiments, pairs of printed circuit dielectric layers ([315, 316], [340, 341], [345, 346], [350, 351]) are formed simultaneously on each side of the assembly.

REFERENCES:
patent: 6469673 (2002-10-01), Kaiponen

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