Integrated passive devices fabricated utilizing multi-layer,...

Wave transmission lines and networks – Coupling networks – Frequency domain filters utilizing only lumped parameters

Reexamination Certificate

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C333S204000

Reexamination Certificate

active

07068124

ABSTRACT:
The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.

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