Integrated pad and fuse structure for planar copper metallurgy

Details Integrated pad and fuse structure for planar copper metallurgy Integrated pad and fuse structure for planar copper metallurgy

1996-06-28

1998-03-24

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257762, 257763, 257764, 257766, 257774, H01L 2900, H01L 2348, H01L 2352, H01L 2940

Patent

active

057316244

ABSTRACT:
A semiconductor interconnection consists of a corrosion resistant integrated fuse and Controlled, Collapse Chip Connection (C4) structure for the planar copper Back End of Line (BEOL). Non copper fuse material is directly connected to copper wiring.

REFERENCES:
patent: 3555365 (1971-01-01), Forlani et al.
patent: 3564354 (1971-02-01), Aoki et al.
patent: 4873506 (1989-10-01), Gurevich
patent: 5389814 (1995-02-01), Srikrishnan et al.
patent: 5663590 (1997-09-01), Kapoor
J.E. Cronin, et al., Polysilicon Strap Process for Fuses, Mar. 1990.
K.B. Albaugh, et al., Fuse Structure for Wide Fuse Materials Choice, vol. 32, No. 3A, Aug. 1989, p. 438-439.
J.E. Cronin, et al., Method to Incorporate Three Sets of Pattern Information in Two Photomasking Steps, vol. 32, No. 8A, Jan. 1990, pp. 218-219.

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