Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate
2007-04-24
2007-04-24
Nguyen, Tuyen T. (Department: 2832)
Inductor devices
Coil or coil turn supports or spacers
Printed circuit-type coil
Reexamination Certificate
active
10932396
ABSTRACT:
Provided are methods and devices in which an inductor is embedded in a package adapted to carry an integrated circuit and a magnetically permeable material is also embedded in the package so that the inductor and the magnetically permeable material are magnetically coupled to each other. In one embodiment, the magnetic permeable material is shaped as a pin which is press-fit into the core of a helix-shaped inductor embedded in the package substrate.
REFERENCES:
patent: 6452247 (2002-09-01), Gardner
patent: 6727154 (2004-04-01), Gardner
patent: 6727794 (2004-04-01), Busletta et al.
patent: 2006/0152323 (2006-07-01), Pavier
patent: 2001-168930 (2001-06-01), None
Chickamenahalli, S., H. Braunisch, J. He, S. Srinivasan, U. Shrivastava, & B. Sankman, “RF Packaging and Passives: Design, Fabrication, Measurement and Validation of Package Embedded Inductors”,IEEE Transactions on Advanced Packaging, Nov. 2005, vol. 28, Issue 4, pp. 665-673.
Gikow, E., “Inductors and Transformers”,Electronics Engineers′ Handbook, 1982, no date.
Kramer, S.E., “Via Hole Plugging Processes”,Printed Circuit Design&Manufacture, Mar. 2004, pp. 44-47, no date.
Lempkowski, R.B., and R.T. Croswell, “PWB-Embeddable Lateral Ferrite Core Inductor and Method of Forming Thereof”, Oct. 2001, no date.
Polka, L., S. Chickamenahalli, C. Chung, D.G. Figueroa, Y. Li, K. Merley, D. Wood, & L. Zu, “Package-Level Interconnect Design for Optimum Electrical Performance”,Intel Technology Journal, Q3 2000, pp. 1-17, no month.
“Single Package Radio for Handsets Applications”, [online], [Retrieved on May 28, 2004], retrieved from the Internet at <URL: http://www.ece.uci.edu/rfmems/res-pckg.html>, 1.
Vardaman, E. Jan, “Are Embedded Passives Ready for Prime Time?”,Circuits Assembly, Jul. 2003, pp. 12-13, no date.
Yoon, Y., E. Chen, M.G. Allen, & J. Laskar, “Embedded Solenoid Inductors for RF CMOS Power Amplifiers”,Proceedings of Solid-State and Actuators, Transducers '01 EurosensorsXV, vol. 2, 2001, pp. 1114-1117, no month.
Frutschy Kristopher J.
Shrivastava Udbhava A.
Intel Corporation
Konrad Raynes & Victor LLP
Nguyen Tuyen T.
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