Integrated package design and method for a radiation sensing...

Details Integrated package design and method for a radiation sensing... Integrated package design and method for a radiation sensing...

2006-08-01

2006-08-01

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

C250S346000

Reexamination Certificate

active

07084010

ABSTRACT:
A radiation detector (10) has a base (30), a frame (48), a window (46), and solder layers (50, 52) formed from a solder pre-form (58, 60) to define a vacuum chamber (56). Feedthroughs (18, 40, 44) penetrate the base (30) for electrical connection to internal components. A method for sealing the detector (10) aligns a lower detector assembly (62), the frame (48) the window (46), and the solder pre-forms (58, 60) in a non-sealed relation within a processing chamber (80, 94). High temperature and low pressure is imposed, and the getter (42) is activated by resistive heating imposed by current leads (88). The window (46), frame (48), and lower detector assembly (62) are then pressed together and sealed by the liquefied solder pre-forms (58, 60). The method eliminates the need for a seal port, combines several steps within the processing chamber (80, 94), and eliminates certain prior art cleaning steps.

REFERENCES:
patent: 5397897 (1995-03-01), Komatsu et al.
patent: 5399897 (1995-03-01), Cunningham et al.
patent: 5433639 (1995-07-01), Zahuta et al.
patent: 5521123 (1996-05-01), Komatsu et al.
patent: 5688699 (1997-11-01), Cunningham et al.
patent: 5708269 (1998-01-01), Meissner et al.
patent: 5808350 (1998-09-01), Jack et al.
patent: 5895233 (1999-04-01), Higashi et al.
patent: 5921461 (1999-07-01), Kennedy et al.
patent: 6043982 (2000-03-01), Meissner
patent: 6077046 (2000-06-01), Kennedy et al.
patent: 6122919 (2000-09-01), Patel et al.
patent: 6326611 (2001-12-01), Kennedy et al.
patent: 6413800 (2002-07-01), Kyle
patent: 6479320 (2002-11-01), Gooch
patent: 2002/0175284 (2002-11-01), Vilain
patent: 09 229765 (1998-01-01), None
patent: WO 02/39481 (2002-05-01), None

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