Integrated optics units and methods of manufacturing...

Details Integrated optics units and methods of manufacturing... Integrated optics units and methods of manufacturing...

2007-08-07

2007-08-07

Harrington, Alicia M (Department: 2873)

Optical: systems and elements

Single channel simultaneously to or from plural channels

By surface composed of lenticular elements

C438S069000, C438S462000

Reexamination Certificate

active

10845303

ABSTRACT:
Microelectronic imagers, optical devices for microelectronic imagers, methods for manufacturing integrated optical devices for use with microelectronic imagers, and methods for packaging microelectronic imagers. The optical devices are manufactured in optical device assemblies that provide efficient and highly accurate fabrication of the optics that are used in microelectronic imagers. The optical device assemblies are particularly useful for packaging a plurality of microelectronic imagers at the wafer level. Wafer-level packaging is expected to significantly enhance the efficiency of manufacturing microelectronic imagers because a plurality of imagers can be packaged simultaneously using highly accurate and efficient processes developed for packaging processors, memory devices and other semiconductor devices.

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