Integrated optics device mounting for thermal and high g-shock i

Details Integrated optics device mounting for thermal and high g-shock i Integrated optics device mounting for thermal and high g-shock i

1990-10-09

1991-12-24

Lee, John D.

Optical waveguides

Integrated optical circuit

385147, G02B 612

Patent

active

050746308

ABSTRACT:
An integrated optics (IO) chip comprising an optical signal path disposed in a principal plane of a crystalline chip having a known chip thickness, anisotropic thermal characteristics, and crystallographic orientation, is mounted to a first surface of a similar thermally anisotropic crystalline material substrate. A second surface of the substrate, spaced from the first surface at a substrate thickness approaching the known chip thickness, is bonded to a mounting surface with a visco-elastic polymer adhesive. Employing this adhesive allows a substantial reduction in the thickness of the substrate as compared to the thickness of the IO chip while allowing vibration and high G-shock loads to be imparted on the structure without affecting the electro-optical properties of the IO chip.

REFERENCES:
patent: 4750800 (1988-06-01), Fournier et al.
patent: 4867524 (1989-09-01), Courtney et al.
patent: 4871226 (1989-10-01), Courtney et al.
patent: 4964688 (1990-10-01), Caldwell et al.

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