Integrated optics and electronics

Details Integrated optics and electronics Integrated optics and electronics

2005-07-01

2008-08-19

Jackson, Jr., Jerome (Department: 2815)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257S098000, C257S082000, C257SE33073, C372S050100, C372S050230, C385S049000, C385S090000

Reexamination Certificate

active

07413917

ABSTRACT:
An optoelectronic device includes a submount and a lid. The submount includes a substrate and a lens and a laser above the substrate. The lid defines a cavity having a surface coated with a reflective material to form a 45 degree mirror. The mirror reflects a light from the laser to the lens and the light exits the optoelectronic device through the submount.

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