Integrated optical transceiver chip

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

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385 31, 385 37, 385 88, G02B 636

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active

055027857

ABSTRACT:
A transceiver is described which utilizes D-shaped optical fiber technology and advanced flip chip mounting techniques for manufacturing an integrated transceiver chip for use in electronic microcircuit applications. A single D-shaped optical fiber is used for bi-directional signal transmission, with coupling gratings superimposed on the flat surface of the fiber for coupling light into and out of the optical fiber. A light source and optical detector, aligned with the respective coupling grating for optical communication with the fiber, are flip mounted on the substrate which supports the fiber. Finally, the light source and optical detector are electrically connected with associated electronic circuitry also mounted or fabricated on the substrate.

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patent: 4725114 (1988-02-01), Murphy
patent: 5187760 (1993-02-01), Huber
patent: 5345524 (1994-09-01), Lebby et al.
patent: 5345527 (1994-09-01), Lebby et al.
AMP Incorporated data sheet on "FSD Transceiver" (2 pages: 40 and 42). Jan. 29, 1993.
Sumitomo Electric Industries, Ltd.; SEI News; "SM Fiber Optic Compatible FDDI Optical Data Link Developed"; No. 92-14; Sep. 1992 (1 page).
Wong, W. S. et al.; "Flip Chip Manufacturing Technology for GaAs MMIC"; 1993 U.S. Conf. on GaAs Manufacturing Technology; pp. 224-227. No Month.
Wang, D. C. et al.; "Low Cost GaAs Flip Chip MMICs For Microwave T/R Module Assembly"; 1993 GOMAC Conference; 1993; pp. 131-132. No Month.

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