Integrated optical sub-assembly having epoxy chip package

Details Integrated optical sub-assembly having epoxy chip package Integrated optical sub-assembly having epoxy chip package

2007-12-11

2007-12-11

Font, Frank G. (Department: 2883)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S014000, C385S093000, C385S089000, C385S092000

Reexamination Certificate

active

10836134

ABSTRACT:
An optical sub-assembly includes a circuit and one or more electronic components electrically connected to the circuit. One of the electronic components is an optoelectronic device capable of transmitting or receiving light signals. Mounted to a surface of the optoelectronic device is an optical conduit. A first end of the optical conduit mounts to the optoelectronic device and a second end optionally cooperates with an optical component, such as a lens. The optical conduit channels light signals propagating toward or away from the optoelectronic device, while the optical component focuses or collimates such light signals. Securing the optical conduit relative to the optoelectronic device is a protective material such as a resin, epoxy, or other suitable material.

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