Integrated optical circuit package

Details Integrated optical circuit package Integrated optical circuit package

1983-12-29

1986-09-16

Sikes, William L.

Radiant energy

Ionic separation or analysis

Static field-type ion path-bending selecting means

350 9610, 350 9621, 350320, 250227, 357 72, 357 19, H01L 3112, H04N 927, H01J 516, G02B 636

Patent

active

046118861

ABSTRACT:
A packaging scheme for apparatus including integrated optical components, such as transmitters, receivers and transceivers. The components are provided in the form of semiconductor chips bonded to a substrate such as ceramic. A glass cover which includes a light transmission path is mounted over the chips. Connectors to optical fibers are formed by molding a material over the substrate and cover. Alignment is effected by use of etched grooves in the cover which are matched to ridges in the mold.

REFERENCES:
patent: 3780352 (1973-12-01), Redwanz
patent: 4007978 (1977-02-01), Holton
patent: 4100422 (1978-07-01), Thillays
patent: 4173389 (1979-11-01), Curtis
patent: 4225213 (1980-09-01), McBride, Jr. et al.
patent: 4373778 (1983-02-01), Adham
patent: 4396935 (1983-08-01), Schuck

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